dicing
英 [ˈdaɪsɪŋ]
美 [ˈdaɪsɪŋ]
v. 将(肉、菜等)切成小方块; 将…切成丁
dice的现在分词
柯林斯词典
- 骰子;色子
Adiceis a small cube which has between one and six spots or numbers on its sides, and which is used in games to provide random numbers. In old-fashioned English, 'dice' was used only as a plural form, and the singular wasdie, but now 'dice' is used as both the singular and the plural form. - 掷骰子游戏
Diceis a game which is played using dice. - VERB 把(食物)切成小块;将…切丁
If youdicefood, you cut it into small cubes.- Dice the onion...
把洋葱切成丁。 - Add the crushed garlic and remaining diced vegetables.
加入捣碎的大蒜和剩余的蔬菜丁。
- Dice the onion...
双语例句
- The secondary advantages can include a significant reduction of labor costs, as no post visual inspection is needed as in traditional dicing processes.
第二大优点包括,降低了人工费用,不需要常规的后续视觉检测。 - Alphablox provides drill-down and slicing and dicing capabilities that can answer the types of business questions that we asked earlier.
Alphablox提供向下钻取和细分功能,以回答我们先前提出的业务问题。 - After an analysis of the process of semiconductor fabrication, a proposal of the wafer dicing using micro-abrasive waterjet is put forward.
通过对半导体加工工艺的分析研究,提出了用磨料水射流切割半导体材料,包括晶圆的切割、芯片的终端封装切割。 - You're dicing with death by driving that car so fast.
你把车开得那么快简直在找死。 - Dicing area can be washed by water directly and easily be cleaned up.
切菜区域可直接用水冲刷,清洗方便。 - A lady doesn't crawl around on the decks dicing with the crew.
高贵女士可不会和船员们在船的甲板上来回爬。 - Normally as a result, material removal rates and therefore dicing speed is lowered and the laser capability with respect to the available power is far from optimized.
通常情况下,剥离速度和切割速度都是很低的。基于其本身的能力来讲,激光器没有运行在最优化的状态下。 - Upon the installation of a multi beam laser dicing system, the obviously advantages of using such a laser dicing process become evident.
基于已经安装的多光束激光划片系统,其显著的优点已经得到证实。 - Study on Mechanism and Driving Error of θ Axis for the Abrasive Dicing Saw
砂轮划片机θ向机构和传动误差分析 - A multiple beam, sub surface laser dicing technology is currently being developed, which will improve the productivity of such a process significantly.
多光束内部激光划片技术正在开发中,它将显著提高产量。
